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Foundry Technology Customer Lead


This is a Contract position in Ashburn, VA posted November 21, 2021.

Job ID: JR0180943 Job Category: Engineering Primary Location: Hillsboro, OR US Other Locations: US, California, FolsomJob Type: Experienced Hire Foundry Technology Customer Lead Job DescriptionJoin Intel-and build a better tomorrow.

Intel is in the midst of an exciting IDM2.0 transformation, with a vision to create and extend computing technology to connect and enrich the lives of every person on Earth.

So join us-and help us create the next generation of technologies that will shape the future for decades to come.Foundry Technology Customer Leads will be responsible for but not limited to:Serve as the lead Intel process expert and primary interface between Intel Logic Technology Development (LTD), the Intel Foundry Services (IFS) business unit, and external foundry customers to drive timely process/design solutions and ensure we achieve leadership foundry products on Intel’s advanced manufacturing technologies.Provide regular communication and report outs on foundry process development execution and product health to Intel senior management and external customers.Support product development on all foundry silicon technology aspects from process definition, wafer costs, IP and product design execution, process modeling and design rules, mask tapeout, through silicon manufacturing.

Own and lead LTD’s response to customer requests and issues for process technology and manufacturing.Program manage all LTD customer technology deliverables, maintain and track process program and product PoRs, and represent plans in internal execution planning.Support customer process technology documentation and training for design and test execution.Coordinate New Product Introduction (NPI) execution, lot tracking, skew handling, device performance, yield, and reliability and variability analysis for customer designs.Work with Process Integration, Device, and Yield teams to assess and monitor process compliance to customer technology maturity metrics spanning fab process yield, electrical performance, and physical silicon structure Cpks through development and into HVM.Work with central TD factory teams to set product yield and performance commits, lot throughput time commits, fab wafer capacity and manufacturing long-range planning, and lot starts for foundry test chips and products.Collaborate with Process Integration, Device, and Design Enablement teams to ensure the highest-quality Process Design Kit (PDK) technology collaterals and support design usage.

May include analysis of fab metrology, E-test, and yield process data, silicon-to-simulation analysis versus variability targets, design rule and layout effect assessments, design rule waiver reviews, and product parametric correlation.Collaborate with Yield, Device, and product engineering central teams to drive improvement changes to product design and process to achieve optimum product yield and performance and support silicon test/debug.Define and drive foundry customer service best practices, IP/data management and systems, and improvements to fab and development operational systems and methodologies.What we offer:We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results.We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation).We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.We’re constantly working on making a more connected and intelligent future, and we need your help.

Change tomorrow.

Start todayQualificationsYou must possess the below minimum qualifications to be initially considered for this position.

Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Experience would be obtained through a combination of prior education level classes, and current level school classes, projects, research, and relevant previous job and internship experience.Minimum Qualifications:Candidate must have a Masters in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering or related field10 years of semiconductor industry experience.Preferred Qualifications:PhD degree in Electrical Engineering, Materials Science, Chemical Engineering, Chemistry, Physics, Mechanical Engineering or related field2 years of Semiconductor foundry customer experience; may include wafer foundry field service, design IP or EDA supplier, or fabless product development2 years of organizational, planning, and program management skills for large complex engineering development project2 years of semiconductor process history and future roadmaps, IC electronics product markets, and key product indicator trends and benchmarks.Applied industrial experience for 5 years at least one of the following technical areas (not all are required):Semiconductor processing, device physics, device architecture and integration, and electrical characterization techniques on leading edge nodes.IC wafer fabrication techniques, semiconductor materials, and wafer test (e.g.

fabrication areas may include photolithography and advanced patterning, thin film deposition, planarization, defect metrology or spectroscopy).Advanced research on future transistor architectures and device physics and CMOS process integration.Process Design Kit (PDK) silicon model target generation and use, silicon-to-simulation correlation, and test structure tegrated circuit product or complex IP development including VLSI digital and/or analog/mixed-signal design using state of art Computer-Aided Design tools and flows on advanced process side this Business GroupAs the world’s largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.

Employees in theTechnology Development and Manufacturing Groupare part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.Other LocationsUS, California, FolsomPosting StatementAll qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USExperienced HireJR0180943HillsboroTechnology and Manufacturing